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Microchip Fabrication, 5th Ed., by Peter Van Zant
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Used for training, teaching, and vocational-technical programs, this book covers various stages of semiconductor processing, from raw material preparation to packaging and testing and traditional processes. Each chapter contains quizzes and review summaries, along with an extensive glossary.
- Sales Rank: #1670434 in Books
- Published on: 2004-06-09
- Original language: English
- Number of items: 1
- Dimensions: 9.10" h x 1.89" w x 6.20" l, 2.15 pounds
- Binding: Hardcover
- 642 pages
From the Back Cover
New to this Edition:
* Nanotechnology
* 300-mm Wafer Processing
* "Green" Processes and Devices
* New Fabrication Advances
The #1 book in the industry -- completely revised and updated
A perfect introduction to the industry that drives high tech, Microchip Fabrication offers a low-math, straight-talk approach to the entire process of semiconductor processing -- from raw materials through shipping the finished, packaged device. With lots of detailed illustrations and analogies to everyday life, this is the industry's most novice-friendly text! Used for training, teaching, and vocational-technical programs, Microchip Fabrication covers every stage of semiconductor processing, from raw material preparation to packaging and testing and traditional and state-of-the-art processes. Each chapter contains quizzes and review summaries buttressed by an extensive glossary.
By the time you've finished Microchip Fabrication, you'll have a solid working knowledge of the important issues and processes and materials and methods involved in semiconductor technology, whether on the subatomic level or in the context of large-scale industrial practices.
Review:
" ... An excellent reference for anyone who wishes to know more about the technical side of semiconductor manufacturing. It is well-indexed, and the chapters are self-contained enough to make it useful for catching up on one topic at a time." -- FabTime, on the previous edition
About the Author
Peter Van Zant is an internationally known semiconductor professional with an extensive background in process engineering, training, consulting, and writing. Principal of Peter Van Zant Associates, a firm that supplies writing, training, and consulting services to business and industry, he is the author of Semiconductor Technology Glossary, Third Edition; Integrated Circuits Text; Safety First Manual; and Chip Packaging Manual. His books and training materials are used by chip manufacturers, industry suppliers, colleges, and universities. Peter Van Zant Associates' customers include Intel, National Semiconductor, Applied Materials, Air Products and Chemicals, SCP Global Inc., and a number of educational institutions. Mr. Van Zant is also the elected District 1 Supervisor in his home county of Nevada in California.
Most helpful customer reviews
6 of 6 people found the following review helpful.
Good Read
By A Customer
If you have or are in the process of getting your EE, don't bother with this book. As the title says, it's a "Practical Guide" for folks that either have an interest in the topic or wish to get a bit deeper into the issues involved in wafer and semiconductor manufacturing due to job requirements etc... it is not a text book.
I would have given the book 5 stars except there are several glaring issues with this book. Given the target audience and general education level of its readers, I think some of the issues are inexcusable.
Typos and grammatical errors abound in this book. The Editor at McGraw Hill must have been asleep or been so completely uninterested in the topic that they didn't bother to check. Also, there are issues with decimal point placement throughout the book. It's sufficiently technical that someone should have bothered to verify the figures before publishing. I also would like to have seen higher quality illustrations/pictures and some logic applied to their placement.
This book is due for an update SOON. It positions die shifts to 180 nanometers as an up and coming event. Intel currently has 90 nanometer manufacturing up and running, with products entering the channel in 4Q03. Not to mention, graphics chip companies and their fab partners have made the shift to 130 nanometers. These process and manufacturing changes bring a whole host of new issues, challenges, opportunities and technologies to the mix.
All in all, this is a good book.
6 of 6 people found the following review helpful.
updated undergraduate text
By W Boudville
[A review of the 5th edition.]
Zant gives an update of his long running book on chip making. It is useful as a quick overview of the salient steps used by many fabs. The text starts with a precis of the industry's history, and, naturally, the seminal and continued significance of Moore's Law.
The wafer fabrication pages describe the predominant Chemical Vapour Deposition method. But the book also finds space for a quick explanation of Molecular Beam Epitaxy. Though the latter is still largely a research method.
Patterning and photolithography are vital processing steps. You should have a solid grasp of these ideas from the relevant chapters. Later steps of layer deposition and metallisation build up the circuit.
A lot of the text is basically unchanged from earlier editions. Since many key ideas have remained constant for decades. Rather, it has been the industry's singular success in applying those ideas to ever greater precision. Hence, the book explains why the decreasing linewidths (now in the deep submicron of around 0.18) and the move to 300mm wafers have kept us moving along Moore's Law.
The book is roughly at an undergraduate level in material science or electrical engineering. [Professionals should seek more detailed texts.]
3 of 3 people found the following review helpful.
Great starting point
By A Customer
This book is clear and readable -- not your average text book. I'm making a mid-life career change from architect to patent writer for the semiconductor industry. This book has been invaluable. It's not full of a lot of formulas or theory, but it will definitely help you understand what is involved in manufacturing semiconductor devices. The only things I might ask for are 1)Better Prufreeding, and B) more pictures of the process machinery; there are a few, but the author relies mainly on diagrammatic drawings to illustrate equipment. But, that said, there are a lot of drawings and they are very well drawn (unlike some of the fuzzy drawing representations in Wolf's Vol. 1 of Semiconductor Devices for the VLSI Era. The VanZant book is way cheaper, too).
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